Nondestructive Damage Evaluation of Electro-mechanical Components Using a Hybrid, Computational and Experimental, Approach

With the electronic industry being one of the most dynamic, in terms of new technologies, electronic packages have to be designed and optimized for new and ever more demanding applications in relatively short periods of time. This, in turn, indicates a need for effective quantitative testing methodologies. In this paper, a novel hybridized use of nondestructive, noninvasive, remote, full field of view, quantitative opto-electronic holography techniques with computational modeling is presented. The hybridization is illustrated with a representative application, which shows that the combined use of opto-electronic holography techniques and computational modeling provides an effective engineering tool for nondestructive study of electro-mechanical components.